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5 cm1 or 16
and down to about 0
注意：本文件於2007年全面重新編寫。
The outcome of this applicable wafer edge trimming approach will be helpful to the subsequent wafer thinning process in the 3DS-IC process
E02000 - SEMI E20 - Cluster Tool Module Interface: Electrical Power and Emergency Off Standard Revision:SEMI E20-0697 (Reapproved 1102) - Superseded 5 cm1 or 16This standard was technically approved by the global Physical Interfaces & Carriers Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published in 1991; previously published November 2002. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of the standard is to specify the Emergency Off
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